Advanced Packaging: Breaking the Limits of Moore’s Law

from The Deep Dive Lab: Unraveling Materials Science · host Son Hoang

When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

Episode metadata supplied by the publisher feed · Published Sep 24, 2025

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Advanced Packaging: Breaking the Limits of Moore’s Law

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This episode was published on September 24, 2025.

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