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Advanced Packaging: Breaking the Limits of Moore’s Law episode artwork

EPISODE · Sep 24, 2025 · 16 MIN

Advanced Packaging: Breaking the Limits of Moore’s Law

from The Deep Dive Lab: Unraveling Materials Science · host Son Hoang

When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

What this episode covers

When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

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Advanced Packaging: Breaking the Limits of Moore’s Law

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Frequently Asked Questions

How long is this episode of The Deep Dive Lab: Unraveling Materials Science?

This episode is 16 minutes long.

When was this The Deep Dive Lab: Unraveling Materials Science episode published?

This episode was published on September 24, 2025.

What is this episode about?

When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

Can I download this The Deep Dive Lab: Unraveling Materials Science episode?

Yes, you can download this episode by clicking the download button on the episode player, or subscribe to the podcast in your preferred podcast app for automatic downloads.
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