EPISODE · Jan 14, 2020 · 55 MIN
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
from Reliability Matters · host Mike Konrad
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void ReductionGreg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"Download here: https://tinyurl.com/szx3xt8Greg Smith can be reached here: [email protected] Lentz can be reached here: [email protected]
What this episode covers
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void ReductionGreg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"Download here: https://tinyurl.com/szx3xt8Greg Smith can be reached here: [email protected] Lentz can be reached here: [email protected]
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Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
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