EPISODE · Jun 24, 2026 · 17 MIN
台積電玻璃核心載板技術深度解讀
from 三瘋資料庫 · host 一天瘋三次
這些來源主要探討台積電與揖斐電、群創合作開發的玻璃核心載板技術，並指出該創新已從概念進入產業驗證階段。這項技術的核心價值在於提供極佳的平整度與電源完整性，能有效解決大型 AI 晶片在封裝時面臨的翹曲與散熱難題。專家指出，相較於提升生產效率的面板級封裝，玻璃基板是實現未來更高算力晶片的必要條件，能直接增強系統效能。雖然玻璃核心單價昂貴且技術難度高，但其帶來的良率提升與算力溢價將驅動 Nvidia 等頂尖客戶在 2028 年底前後開始採用。 -- Hosting provided by SoundOn
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