EPISODE · Jun 27, 2026 · 32 MIN
Under the Hood of Intelligent Systems
from EE Times Current · host EE Times On Air
Some of the most critical semiconductor innovation today sits beneath intelligent systems, where data moves, connects, and scales. As architectures become more distributed, sensor-rich, and AI-driven, challenges in bandwidth, latency, power, and interoperability intensify. In this episode, we unpack the interface technologies driving this evolution: from automotive SerDes to advanced imaging and next-gen connectivity.
NOW PLAYING
Under the Hood of Intelligent Systems
No transcript for this episode yet
Similar Episodes
Sep 29, 2023 ·76m
Sep 29, 2023 ·73m
Sep 29, 2023 ·72m
Sep 29, 2023 ·75m
Sep 29, 2023 ·75m
Sep 29, 2023 ·73m