2026 TSMC 科技論壇竹科

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詳盡說明了台積電（TSMC）在先進半導體製程上的最新技術進展與全球佈局規劃。受人工智慧（AI）與高效能運算需求激增的帶動，半導體市場預計在 2030 年將達到 1.5 兆美元的規模。為應對此趨勢，台積電正加速推動 N2、A16 以及 A14 等尖端製程的量產與產能擴張，並同步優化 CoWoS 與 SoIC 等先進封裝技術。公司同時擴展在美國、日本及歐洲的全球生產基地，以滿足多元化的客戶需求。 -- Hosting provided by SoundOn

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2026 TSMC 科技論壇竹科

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