20260513-E：封裝載板廠證實味之素「大漲價30%」成本壓力源仍是CCL / 三星半導體獎金戰延燒全產業　韓企恐陷「分紅通膨」困局

掌握前瞻趨勢與科技脈動，立即訂閱 IC之音電子報：https://pse.is/8wpwwx--今日科技產業新聞要點：1. 封裝載板廠證實味之素「大漲價30%」成本壓力源仍是CCL2. 三星半導體獎金戰延燒全產業韓企恐陷「分紅通膨」困局3. 韓美戰略深度聯盟隱憂盧超群示警對台灣恐成10年挑戰4. 4月營收降溫又怎樣面板業賣廠造銀彈轉向CPO、FOPLP收聽《DIGITIMES每日新聞》：https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208 王小姐

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20260513-E：封裝載板廠證實味之素「大漲價30%」成本壓力源仍是CCL / 三星半導體獎金戰延燒全產業　韓企恐陷「分紅通膨」困局

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