20260625-M：日月光吳田玉：AI一口氣塞爆產能　鬆口封測漲價有3層考量 / 三星、SK海力士湖南建廠傳聞升溫　不只封測廠、前段晶圓廠也入列

掌握前瞻趨勢與科技脈動，立即訂閱 IC之音電子報，2026/7/5 前訂閱再抽千元禮券等多項好禮：https://pse.is/98vqbe--今日科技產業新聞要點：1. 日月光吳田玉：AI一口氣塞爆產能鬆口封測漲價有3層考量2. 三星、SK海力士湖南建廠傳聞升溫不只封測廠、前段晶圓廠也入列3. 傳SK海力士放緩HBM4擴產轉攻高獲利「通用DRAM」4. NVIDIA推進歐洲35座AI超級電腦總算力最高達800 Exaflops5. 蘋果傳2028年導入1.4奈米製程消費級SoC升級爭產能趨勢恐長期延續6. 記憶體漲價壓力未解可撓式AMOLED手機面板報價3Q臉綠7. 樂金化學擴產CCL 目標2030年電子材料事業規模倍增8. 次世代電晶體通道材料日本東大成功研發直徑1奈米碳管9. 2奈米先進製程廢液暴增13倍台鎔看好半導體ESG需求搶攻處理市場10. 現代汽車集團傳再挖角Tesla、NVIDIA人才全面加速SDV布局收聽《DIGITIMES每日新聞》：https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208 王小姐

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20260625-M：日月光吳田玉：AI一口氣塞爆產能　鬆口封測漲價有3層考量 / 三星、SK海力士湖南建廠傳聞升溫　不只封測廠、前段晶圓廠也入列

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