3 Shifts Edition (Apr 10 2026): Anthropic's Mythos and Project Glasswing, Is advanced chip packaging the next AI bottleneck?, The business of weather modification

Hi everyone – welcome to your 3 Shifts Edition [AI-generated audio version].First, Anthropic’s new Mythos frontier model – rumored to be in the 10T-parameter class – may be cybersecurity teams’ best tool and worst nightmare. It’s being tightly controlled under Project Glasswing for now, but expect malicious actors to be wielding Mythos-level capabilities in maybe 6-24 months.Next, advanced chip packaging might be AI’s next chokepoint. Seems like everyone is investing in expanding their packaging capacity – including TSMC, Intel, Samsung, traditional OSAT firms ASE and Amkor, memory-chip players SK Hynix and Micron, and even SpaceX.Finally, there’s growing interest in trying to control the weather. The technology exists for basic weather control, and 50+ countries are already working on or experimenting with cloud seeding. China has the most ambitious program, with operations running year-round.Enjoy.TamSign up for free briefs mostly written by real people on 6Pages.com