EPISODE · Sep 29, 2011 · 1 MIN
Adhesive Lets 3-D Microchips Go Deep
from 60-Second Tech · host Scientific American
IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports
Embed this episode
Ready to play
Adhesive Lets 3-D Microchips Go Deep
0:00
1:15
1×
No transcript for this episode yet
Similar Episodes
No similar episodes found.
Similar Podcasts
No similar podcasts found.
Frequently Asked Questions
How long is this episode of 60-Second Tech?
This episode is 1 minute long.
When was this 60-Second Tech episode published?
This episode was published on September 29, 2011.
Can I download this 60-Second Tech episode?
Yes. Use the download control on the episode player to save the publisher-provided media file.
URL copied to clipboard!