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Adhesive Lets 3-D Microchips Go Deep episode artwork

EPISODE · Sep 29, 2011 · 1 MIN

Adhesive Lets 3-D Microchips Go Deep

from 60-Second Tech · host Scientific American

IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports

Episode metadata supplied by the publisher feed · Published Sep 29, 2011

What this episode covers

IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports

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This episode is 1 minute long.

When was this 60-Second Tech episode published?

This episode was published on September 29, 2011.

What is this episode about?

IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports

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