EPISODE · Aug 12, 2024 · 19 MIN
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
from In The Arena by TechArena
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
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Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
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