AI大廠瘋搶日東紡載板材料先進封裝關鍵材料也成台廠鎖定商機/Pat Gelsinger訪日評Rapidus 強調須與台積電技術差異化

今日科技產業新聞要點：1.AI大廠瘋搶日東紡載板材料先進封裝關鍵材料也成台廠鎖定商機2.Pat Gelsinger訪日評Rapidus 強調須與台積電技術差異化3.傳小米已註冊「玄戒O2」 2奈米製程挑戰高通、蘋果4.台積也難逃專利蟑螂攻擊台系供應鏈結盟還擊5.「客製化HBM」時代將啟 SK海力士有望持續領航6.膽固醇液晶搭上德鐵「省90%能耗」達擎攻歐洲綠運輸商機7.歐、中電動車最低價格談判豬、酒、稀土全擺上桌8.現代汽車、SK On推遲美國合資廠投資設備商陷資金困境9.Tesla拿下中國GWh儲能眾中系廠在美擱淺10.中美稀土角力未解更多美企遭受池魚之殃2025 Ansys Taiwan Simulation World 用戶技術大會 8/13 盛大登場！今年以「AI 驅動未來模擬，開啟研發新世代」為主軸重磅邀請台積電、聯發科、AMD、台達等產業領袖分享模擬技術在晶片、3DIC、電動車等領域的應用探討如何加速研發、推動創新！席位有限，報名從速！ ▶️ https://pse.is/2025_simworld 收聽《DIGITIMES每日新聞》：https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208 王小姐

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AI大廠瘋搶日東紡載板材料先進封裝關鍵材料也成台廠鎖定商機/Pat Gelsinger訪日評Rapidus 強調須與台積電技術差異化

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