AI晶片兩大新戰場浮上檯面記憶體、網通巨頭齊聚SEMICON/半導體黃金時刻到來日月光吳田玉：廣結善緣突破瓶頸

今日科技產業新聞要點：1. AI晶片兩大新戰場浮上檯面記憶體、網通巨頭齊聚SEMICON2. 半導體黃金時刻到來日月光吳田玉：廣結善緣突破瓶頸3. 中國半導體設備支出轉折向下美日歐新勢力竄起4. 省電面板為AI PC關鍵友達LTPS、OLED測試結果揭曉5. 水冷散熱新時代屆臨地利之便帶動台廠零件新商機6. 折疊機銷售遭逢勁敵三星推新戰略刻不容緩7. 中國彩色電子紙1H24銷量年增逾3成元太、虹彩垂涎市場8. 深圳新能源車產量、滲透率居冠從上下游一窺中國新訊9. 市場成長放緩美國EV市佔率預測遭下調10. 全球百大汽車零組件供應商中國上榜15家、台廠在別處超車11. 經濟部百億補助奏效？台IC設計逾4成採用先進製程12. 不甘外商吃肉台廠喝湯國產6G射頻與基頻晶片2025下線收聽《DIGITIMES每日新聞》：https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208 王小姐

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AI晶片兩大新戰場浮上檯面記憶體、網通巨頭齊聚SEMICON/半導體黃金時刻到來日月光吳田玉：廣結善緣突破瓶頸

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