EPISODE · May 23, 2026 · 11 MIN
AI引发半导体全产业链变革
from 深度
AI算力倒逼半导体工艺重构，增长逻辑从单一晶体管微缩转向3D晶体管、背面供电及新材料组合创新。从2027年起，先进封装、光刻材料、光子SOI及玻璃基板将进入放量期，带动全产业链价值重估。台积电扩产及本土化采购将成为订单传导的核心驱动力，半导体制造正迎来结构、封装与材料的同步升级周期。
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AI引发半导体全产业链变革
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