板卡廠出貨力道復甦華碩主板重返1,500萬片、微星坐三望二 / 危與機並存 Arm強襲x86領土、RISC-V緊追在後

今日科技產業新聞要點：1. 板卡廠出貨力道復甦　華碩主板重返1,500萬片、微星坐三望二2. 危與機並存　Arm強襲x86領土、RISC-V緊追在後3. AI PC消費者反應正面　有望成旺季備貨主力4. 先進製程及封裝升溫　材料通路2H24氣勢延燒5. 中、美IC載板急起直追　有望造就供不應求景象6. 中國AI推論晶片爆發　WAIC中廠「默契」未秀最新晶片7. 三星HBM需求增　子公司Semes強化TCB設備助陣8. 平價5G手機出貨增帶動聯發科手機晶片組市佔成長9. 納智捷第二款EV何時問世？　供應鏈說法透玄機10. 福斯關閉奧迪比利時EV廠　恐付出高昂代價11. 德國強化「公司配車」補貼　為高階純電動車打強心針12. 資料中心看齊RE100？CSP大廠齊聲響應EPD 收聽《DIGITIMES每日新聞》：https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208　王小姐

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板卡廠出貨力道復甦華碩主板重返1,500萬片、微星坐三望二 / 危與機並存 Arm強襲x86領土、RISC-V緊追在後

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