EPISODE · Apr 14, 2026 · 2 MIN
玻璃基板的「工业突围」：半导体物理极限前的最后一次押注
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玻璃基板的「工业突围」：半导体物理极限前的最后一次押注：在 2026 年的半导体版图中，如果说 HBM（高带宽内存）是 AI 算力的心脏，那么封装技术正成为决定这颗心脏跳动频率的胸腔。随着 2026 年 4 月 14 日玻璃基板（Glass Substrates) 封装技术进入试产阶段，一场关于…
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玻璃基板的「工业突围」：半导体物理极限前的最后一次押注
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