Dazi AI Watch 013: From Compute Delivery to Network Re-Architecture — The Next AI Bottleneck Is Not Chips, But Connectivity

If Episode 012 was about turning power, land, and infrastructure into real compute, Episode 013 goes one layer deeper:The next AI bottleneck is not chips — it is connectivity.Buying more GPUs is only the starting point.The real challenge is connecting thousands of GPUs, TPUs, and ASICs into one efficient, low-latency, scalable compute system.This episode explores why AI data centers are entering a network re-architecture cycle, and why CPO, OCS, XPO, LPO, Ethernet, and InfiniBand are becoming key variables in the next stage of the AI infrastructure cycle.Price is only the result. Variables determine the stage.Don’t predict price. Observe the cycle.