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【DIGITIMES每日新聞】20260709-M:三星量產Vera Rubin用eSSD 繼HBM4後再擴AI記憶體版圖 / 日月光全球擴大投資 韓美半導體搶進CoWoS封裝需求 episode artwork

EPISODE · Jul 8, 2026 · 7 MIN

【DIGITIMES每日新聞】20260709-M:三星量產Vera Rubin用eSSD 繼HBM4後再擴AI記憶體版圖 / 日月光全球擴大投資 韓美半導體搶進CoWoS封裝需求

from 科技咖 · host ida.lee

掌握前瞻趨勢與科技脈動,立即訂閱 IC之音電子報:https://pse.is/8wpwwx --今日科技產業新聞要點:1. 三星量產Vera Rubin用eSSD 繼HBM4後再擴AI記憶體版圖2. 日月光全球擴大投資 韓美半導體搶進CoWoS封裝需求3. SK海力士罕見討論供應商漲價要求 向外擴散記憶體景氣紅利4. DeepSeek自研AI晶片 硬體供應走向自主擺脫依賴華為5. 微軟加入AI省錢潮 傳自研MAI模型接手Office任務6. AI需求擴大、旺季效應發酵 鉅橡3Q26出貨動能續升7. 蘋果對外採購未退場 博通、高通與聯發科續卡位網通晶片戰局8. iPhone記憶體成本大漲3.3倍 壓縮蘋果獲利空間9. 中國618手機銷量年減13% 華為逆勢成長、蘋果居次10. 小米汽車新品牌SkyNomad亮相 搶進長續航SUV市場收聽《DIGITIMES每日新聞》:https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208 王小姐

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【DIGITIMES每日新聞】20260709-M:三星量產Vera Rubin用eSSD 繼HBM4後再擴AI記憶體版圖 / 日月光全球擴大投資 韓美半導體搶進CoWoS封裝需求

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