【#封裝問題大】移廠速度不夠快美企憂台積電封裝仍仰賴台灣廠｜寰宇#關鍵字新聞2026.04.23

from 寰宇#關鍵字新聞 Global Hashtag News · host 寰宇新聞台

美國近年擔憂國內AI晶片生產能力不足，可能會引發國家問題，積極推動生產線外包回流的政策。然而，截至目前為止，AI晶片的先進封裝，幾乎全部都是在海外進行，已成為美國的一大隱憂。台積電全球業務副總張曉強表示，公司計畫在2029年前，於亞利桑那廠啟用CoWoS與3D-IC的封裝能力。加入會員，支持節目： https://cku2d315gwbbo0947nezjmg86.firstory.io/join 留言告訴我你對這一集的想法： https://open.firstory.me/user/cku2d315gwbbo0947nezjmg86/comments YT收看《寰宇全視界》👉https://lihi.tv/k5A6u 聽眾五星留言+訂閱👉 https://lihi1.cc/sOHKB 看更多國際政經新聞👉 https://lihi1.com/spnWF 抖內我們這裡請👉 https://lihi1.com/QKnxm Powered by Firstory Hosting

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【#封裝問題大】移廠速度不夠快美企憂台積電封裝仍仰賴台灣廠｜寰宇#關鍵字新聞2026.04.23

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