How Chiplets Are Upending Semiconductor Design Forever

What this episode covers

Episode 25 dives into the chiplet revolution—why the industry is moving from monolithic chips to modular dies stitched together via advanced packaging. Lucas and Luna break down how AMD's Zen architecture proved chiplets work, why Intel is scrambling to catch up, and what it means for the broader supply chain. They reference recent market moves: Broadcom (AVGO) up 9% over five days as its chiplet-based networking silicon gains traction, while Texas Instruments (TXN) slides 9.8%, partly due to slower adoption of advanced packaging in analog. Expect concrete numbers: AMD's Turin chip with 12 chiplets, cost savings of 30-40% for large designs, and why TSMC's CoWoS is the bottleneck. No fluff—just how this architectural shift is rewriting semiconductor economics. #Chiplets #Semiconductor #AMD #Intel #TSMC #AdvancedPackaging #CoWoS #Broadcom #ChipDesign #Technology #SemiconductorIndustry #ZenArchitecture #DieStacking #HeterogeneousIntegration #MooreLaw #FexingoBusiness #BusinessPodcast #TechTrends Keep every episode free: buymeacoffee.com/fexingo

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