How CIN:APSE Is Changing the Rules of High-Reliability Design

Welcome to another episode of The Electropages Podcast, hosted by Robin Mitchell. Today's guest is Jerry Metcalf, Business Development Manager at Cinch Connectivity Solutions, a Bel Fuse company. In this episode, Jerry introduces CIN:APSE, a solderless compression interconnect system that removes the weaknesses of traditional solder joints. The technology allows components to be clamped directly onto flat PCB pads, improving reliability, reducing manufacturing time, and enabling easy recovery of high-value parts without the risk of rework damage. The discussion explores how CIN:APSE performs under extreme vibration, shock, and temperature variation, why it's trusted in space and defence systems, and how it's finding new relevance in AI and high-performance computing. Jerry also explains how its simplicity and modularity make it ideal for compact, low-profile designs and high-reliability environments where maintenance access is limited. Watch to learn how CIN:APSE is redefining connector design for next-generation modular electronics and mission-critical applications.