化圓為方下一個推動先進封裝的革命

from Can 定賺 (Can Definitely Win) · host Dalia

探討半導體先進封裝技術從「晶圓級」轉向「面板級」的範式轉移，並將 CoPoS 視為突破 AI 算力瓶頸的關鍵革命。透過將載體由圓形矽晶圓改為方形面板，製程能大幅提升面積利用率並有效降低生產成本，特別是針對 NVIDIA Rubin 等次世代大尺寸晶片。文中指出 C SUN 志聖與其 G2C+ 聯盟在熱處理及剝膜等核心設備領域具有競爭優勢，並已成功切入台積電供應鏈。此外，技術演進也帶動了玻璃基板與**矽光子（CPO）**的崛起，以解決高功耗下的散熱與訊號傳輸限制。整體而言，台灣供應鏈在 2026 年即將到來的 CoPoS 商轉潮中，憑藉領先的測試與生產設備佔據了產業戰略高地。 -- Hosting provided by SoundOn

Episode metadata supplied by the publisher feed · Published Jan 29, 2026

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化圓為方下一個推動先進封裝的革命

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