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IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips episode artwork

Dec 17, 2011 3 min

IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips

from Computing Now's News Podcast Hosted by IEEE Computer Society

IBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors.

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IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips

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