IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips

from Computing Now's News Podcast · host IEEE Computer Society

IBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors.

Episode metadata supplied by the publisher feed · Published Dec 17, 2011

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IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips

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