纪要精选｜纪要精选晚间版：半导体兑现，医药回暖，供给约束抬头

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半导体制造与先进封装先出现业绩兑现，算力增量向集群、托管与光模块材料扩散；药明康德订单和指引转强，创新药利润改善。钨、化纤、白鸡与实验猴则由供给约束支撑价格，布鲁可呈现国内低价化与海外更快的分化。

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纪要精选｜纪要精选晚间版：半导体兑现，医药回暖，供给约束抬头

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