科技财报速递｜应用材料双超并上修，市场仍在消化高预期

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应用材料本季偏强，营收和非通用会计准则每股收益双双超预期，半导体设备及先进封装增速指引同步上修，原有判断进一步强化。首个完整交易日仍下跌百分之五点一二，主要反映此前涨幅、高估值预期、中国收入占比下降及下一季毛利率环比走平，而非经营逻辑被证伪。

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科技财报速递｜应用材料双超并上修，市场仍在消化高预期

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