科技早餐 03/27｜美國 AI 晶片新規即將上路，科技大廠面臨挑戰

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＊美國 AI 晶片新規即將上路，科技大廠面臨挑戰＊全球晶圓廠設備支出持續成長，台灣穩居前三＊阿里巴巴創辦人示警，AI 資料中心恐現泡沫＊亞馬遜測試 AI 購物與健康助理，擴展生成式 AI 版圖＊微軟 Security Copilot 新增 AI 代理，強化資安防禦延伸閱讀 📖 【AI 智慧大工廠台北場會後報導】產發署、工研院、台達、KUKA 機器人專家共探 AI Robot 應用新篇章 https://buzzorange.com/techorange/2025/03/25/2025-smart-manufacturing-taipei-ai-robot/ -- Hosting provided by SoundOn

Episode metadata supplied by the publisher feed · Published Mar 26, 2025

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科技早餐 03/27｜美國 AI 晶片新規即將上路，科技大廠面臨挑戰

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