Microchip Is... Power Packaging episode artwork

EPISODE · Nov 5, 2025 · 18 MIN

Microchip Is... Power Packaging

from Microchip is... · host Microchip Technology

Interview With Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology Inc.  Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology, explores the role of power packaging in shaping the design and performance of power modules used across industries, including automotive, aerospace, and industrial systems.  Nitesh highlights key aspects of power packaging, including thermal management, parasitic effects, integration, and compliance with industry standards, and stresses how these issues are often underestimated until they become design challenges.  The discussion highlights the risks engineers face when power packaging is overlooked early in development, leading to inefficiencies and thermal problems. Nitesh notes that power modules streamline the process for customers, enabling them to focus on their core expertise while Microchip addresses the complexities of packaging.  He also discusses the importance of module construction and the need to balance design innovation with manufacturability to ensure practical, reliable solutions. Finally, Nitesh advises engineers to design for realistic, intermediate use cases rather than extreme worst-case scenarios, which often result in over-engineering and unnecessary cost.  Find out more about Microchip’s power packaging solutions here: https://www.microchip.com/en-us/products/power-management/silicon-carbide-sic-devices-and-power-modules     Time Stamps  [00:27] - Guest Introduction: Nitesh Satheesh  [01:56] - Importance of Power Packaging  [06:18] - Customer Needs and Power Modules  [08:50] - Benefits of Using Bare Die in Modules  [10:19] - Trade-offs in Module Design  [13:22] - Design vs. Manufacturing: The Secret Sauce  [14:18] - Future Trends in Power Module Design  [16:51] - Key Takeaway for Engineers  [17:48] - Staying Updated with Microchip   Follow Nitesh Satheesh  Nitesh Satheesh on LinkedIn: https://www.linkedin.com/in/nitesh-satheesh/     If you enjoyed this episode, be sure to subscribe to our podcast for more discussions about Microchip’s smart, connected and secure embedded control solutions and connect with us on social media to stay updated on upcoming episodes. We'd also appreciate it if you could leave us a review on your favorite podcast platform.  

Interview With Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology Inc.  Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology, explores the role of power packaging in shaping the design and performance of power modules used across industries, including automotive, aerospace, and industrial systems.  Nitesh highlights key aspects of power packaging, including thermal management, parasitic effects, integration, and compliance with industry standards, and stresses how these issues are often underestimated until they become design challenges.  The discussion highlights the risks engineers face when power packaging is overlooked early in development, leading to inefficiencies and thermal problems. Nitesh notes that power modules streamline the process for customers, enabling them to focus on their core expertise while Microchip addresses the complexities of packaging.  He also discusses the importance of module construction and the need to balance design innovation with manufacturability to ensure practical, reliable solutions. Finally, Nitesh advises engineers to design for realistic, intermediate use cases rather than extreme worst-case scenarios, which often result in over-engineering and unnecessary cost.  Find out more about Microchip’s power packaging solutions here: https://www.microchip.com/en-us/products/power-management/silicon-carbide-sic-devices-and-power-modules     Time Stamps  [00:27] - Guest Introduction: Nitesh Satheesh  [01:56] - Importance of Power Packaging  [06:18] - Customer Needs and Power Modules  [08:50] - Benefits of Using Bare Die in Modules  [10:19] - Trade-offs in Module Design  [13:22] - Design vs. Manufacturing: The Secret Sauce  [14:18] - Future Trends in Power Module Design  [16:51] - Key Takeaway for Engineers  [17:48] - Staying Updated with Microchip   Follow Nitesh Satheesh  Nitesh Satheesh on LinkedIn: https://www.linkedin.com/in/nitesh-satheesh/     If you enjoyed this episode, be sure to subscribe to our podcast for more discussions about Microchip’s smart, connected and secure embedded control solutions and connect with us on social media to stay updated on upcoming episodes. We'd also appreciate it if you could leave us a review on your favorite podcast platform.

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Microchip Is... Power Packaging

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Interview With Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology Inc.  Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology, explores the role of power packaging in shaping the design and performance of...

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