PCB Chat 118: Claire Wemp, Ph.D., on Thermal Interface Materials
from PCB Chat Hosted by PCEA
Thermal interface materials are used for heat transfer in a variety of electronics applications. On this episode of PCB Chat, Claire Wemp, Ph.D, a thermal applications engineer at DuPont, discusses TIM1 materials (and explains the difference between TIM1 and TIM2), when and where they are used, who specifies them, and how they work. Wemp is also a member of the Society Women in Electronics, and in the second half of the podcast we talk about her experience in SWE, which dates to college, DuPont's role in recruiting, and how to bend the curve in attracting more women to STEM fields.
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