Rehm Condenso XC: Even Heating for Complex PCBs
from Global SMT Podcast Hosted by Global SMT and Packaging
Keith Bryant spoke with Luis Garcia of Rehm about the Condenso XC, an entry-level vapour phase soldering machine designed for labs and small, high-mix production batches. PCBs combining large thermal masses with small, sensitive components can be difficult to reflow evenly. The Condenso XC uses Galden vapour to transfer heat efficiently, with temperature limited by the fluid’s boiling point. Two injections control preheat and peak temperature inside a closed chamber, while vacuum helps reduce solder voids. Galden is filtered for reuse, and the machine can also reprocess boards that missed the vacuum stage. Please subscribe for more news on electronics manufacturing, SMT and advanced packaging.
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