日月光、台積電合攻面板級封裝有譜「310x310」成關鍵尺寸/IC通路布局東協再升級車用、封測聚落動能可期

今日科技產業新聞要點：1.日月光、台積電合攻面板級封裝有譜「310x310」成關鍵尺寸2.IC通路布局東協再升級車用、封測聚落動能可期3.北創主導芯源微董事會「80後」掌權尋曝光機技術突圍4.英特爾裁員傳聞四起檳城政府關切現有投資計畫收聽《DIGITIMES每日新聞》：https://reurl.cc/yRz9m6更多科技趨勢 https://pse.is/4drbp9留言心得回饋 https://pse.is/4ee2ft異業合作洽詢 [email protected]廣告合作請洽 [email protected]分機208 王小姐

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日月光、台積電合攻面板級封裝有譜「310x310」成關鍵尺寸/IC通路布局東協再升級車用、封測聚落動能可期

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