RM 84: Christopher Frederickson on Solder Paste Inspection
from PCB Chat Hosted by UP Media Group
Today, we discuss Fit for Use solder paste inspection. As we've repeated several times on this show, it is said most reliability problems begin at the printer. Our industry utilizes a lot of materials in order to produce a circuit assembly. If the materials, specifically the solder paste is out of spec, that can affect reliability. Unfortunately, in most cases, one cannot simply open a jar of solder paste and easily determine visually if the solder paste their applying to the stencil is fit for use, or if it has gone bad, or is out of spec. Mike Konrad's guest will discuss what solder paste fit for use means, and how we can provide methods for determining its fit for use right on the production floor. On a completely unrelated topic, but maybe even more interesting, he also has experience in wearable electronics in temporary tattoos. You bet we ask him about that!
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