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【Tech666】EP139:【先進製程/封裝】因應埃米製程世代,設備業者勝出關鍵在解決方案完整度 ft. 台灣應用材料公司資深處長 吳峯岳 Albert Wu episode artwork

EPISODE · May 26, 2026 · 21 MIN

【Tech666】EP139:【先進製程/封裝】因應埃米製程世代,設備業者勝出關鍵在解決方案完整度 ft. 台灣應用材料公司資深處長 吳峯岳 Albert Wu

from 科技咖 · host ida.lee

掌握前瞻趨勢與科技脈動,立即訂閱 IC之音電子報:https://pse.is/8wpwwx -------------------------------------------------------------------本集必聽:(00:00:00) 開場(00:04:36) 新世代材料面世,鉬相較於鎢,電阻值最多可降低15%(00:07:18) 應材在鉬材料應用的勝出關鍵:製程設備、量測系統、數位工具同步到位(00:14:25) ALD不僅鎖定邏輯製程,記憶體也能發揮技術優勢 -------------------------------------------------------------------製作 | 李翊嘉科技產業瞬息萬變,訊息有真有假、有輕有重, 我們如何在最短的時間內,掌握最重要的資訊?DIGITIMES 與商周攜手推出聯合方案,帶你看懂商業,也看透科技,雙重專業視角幫助你全方位掌握產業趨勢。了解「DIGITIMES 與商周聯購方案」:https://dgt.ms/app_subscribe

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【Tech666】EP139:【先進製程/封裝】因應埃米製程世代,設備業者勝出關鍵在解決方案完整度 ft. 台灣應用材料公司資深處長 吳峯岳 Albert Wu

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