UHDI, AI, and Solder Paste Innovation

Join Tech Consultant Zach Peterson as he chats with Tony Lentz, Chemist and Field Application Engineer with FCT Assembly, about the latest innovations in solder paste for ultra-high density interconnects (UHDI) and the challenges of working with smaller solder powder sizes. The pair also discusses the role of AI in electronics manufacturing and the future of PCB assembly. Tony brings his deep knowledge of materials science and the chemistry of electronics to this insightful discussion, providing valuable perspectives on industry trends and advanced packaging techniques. Tune in to learn about the exciting developments shaping the future of electronics manufacturing. 👉 Connect with Tony Lentz: https://www.linkedin.com/in/tony-lentz-a14a0b64/ 👉 Exclusive 15 Days Free Altium Designer Access: https://www.altium.com/promotions/altium-academy Don't forget to follow us on social to stay up-to-date on the latest Altium Academy content.  👉 Watch this Episode on Our YouTube Channel: https://www.youtube.com/@AltiumAcademy 👉 Follow Altium on TikTok: https://www.tiktok.com/@altiumdesigner 👉 Follow Altium on Twitter: https://twitter.com/altium  👉 Follow Altium on Linkedin: https://www.linkedin.com/company/altium/  👉 Follow Altium on Facebook: https://www.facebook.com/AltiumOfficial/  About Altium LLC Altium LLC (ASX:ALU), a global software company based in San Diego, California,  is accelerating the pace of innovation through electronics. From individual inventors to multinational corporations, more PCB designers and engineers choose Altium software to design and realize electronics-based products. #UHDI #electronicsmanufacturing #AI