Why Chip Packaging Is Becoming the New Lithography

Episode 17 of Semiconductor News with Fexingo dives into advanced chip packaging — the layer of the semiconductor stack that’s suddenly as strategic as lithography. Lucas and Luna break down how TSMC’s CoWoS and Intel’s Foveros are enabling multi-die designs for AI accelerators, why the packaging equipment market is projected to grow 15% annually through 2030, and how companies like Applied Materials and ASM Pacific are racing to build the tools. They also connect the trend to AMD’s 15% weekly stock surge and discuss what it means for smaller players like ASE Technology. A focused look at the invisible revolution inside every modern chip. #AdvancedPackaging #CoWoS #Foveros #TSMC #Intel #AppliedMaterials #ASMPacific #ASE #AMD #ChipDesign #Semiconductors #Technology #Business #FexingoBusiness #BusinessPodcast #ChipShortage #AIHardware #HeterogeneousIntegration Keep every episode free: buymeacoffee.com/fexingo