EPISODE · Apr 6, 2026 · 2 MIN
芯片散热的「热力学终局」：Samsung 领投物理架构 ASIC 的底层逻辑
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芯片散热的「热力学终局」：Samsung 领投物理架构 ASIC 的底层逻辑：在硅基半导体的世界里，「热量」始终是那个挥之不去的幽灵。从数据中心巨大的冷却水塔，到智能手机在高负载下的降频卡顿，散热不仅是工程难题，更是商业天花板。然而，Samsung Catalyst 近期领投一家物理架构 ASIC 初创公司的动作，释…
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芯片散热的「热力学终局」：Samsung 领投物理架构 ASIC 的底层逻辑
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