Electronics Weekly News Bulletins

Infineon CEO resigns; ST not interested in Infineon wireless activities; Semiconductor industry consolidation disastrous: Future Horizons; ST boosts Cortex M3 on-chip memory

Pace secures BT set-top box contract after Philips buy; Field emission boosts Samsung LCD contrast to 300,000; Atmel ARM9 microcontroller dissipates 80mW at 400MHz; IET/GSA Semiconductor Forum: NFC to be in 50 per cent of mobiles by 2010

NXP Semiconductors reports "softness" in semiconductor industry; DMASS reports fall in distributor sales; ZigBee holding back short-range wireless; UK, Ireland technology investment looks promising

Graphene to replace ITO in LCDs; Government skills policy damaging electronics, says Lord Leitch; DRAM musical chairs; Apple 3G iPhone build expected to drive NAND

Rambus case sent for re-trial; Micron and Nanya form Meiya; ST, NXP deal to trigger consolidation; Apple joins IC market with $278m PA Semi buy.

XMOS samples its first 400 MIPS four core chip; ARM cuts power of Cortex-M3 processor; Freescale, Xilinx early movers at Embedded Systems Conference; Oxford University makes digital radio breakthrough

Motorola spins off mobile phone business; Xilinx claims faster FPGA development times; Intel cuts processor power by 30 per cent; TSMC lines up first chips on 40 nm process

Credit crunch could fuel electronics acquisitions; Canadian, German researchers discover superconductors; Nokia slips in Greenpeace ranking; Toumaz signs agreement with Texas Instruments

Tyndall perfects low-power micro LEDs; Intel defends anti-trust allegations; Applied: SADP cost effective production tools; Semiconductor industry facing "huge slowdown in capex"