All Episodes
The EEcosystem Podcast — 106 episodes
The Most Expensive Engineering Mistake (and how to avoid it)
The Engineer as Architect: Agentic AI as Co-Pilot, Not Autopilot
The Hidden Bottleneck in DDR Memory Compliance and How to Fix It
KiCad's Growing Adoption for Professional PCB Design
Design Intent vs. the Grind: Quilter's Vision for AI in PCB Design
Stop Wasting Time in Datasheets: Finally an AI tool that actually helps PCB Designer
Why “Chips Don’t Float”: The Critical Role of PCB Manufacturing in the U.S.
DesignCon 2026 Kick-Off: Chiplet 3D Interconnect Designer from Keysight
DesignCon 2026: Kick-Off Episode with the Dream Team of Power Integrity
CAD Tools that Scale with Engineers
Why Proximity, Security, and the Future of PCB Supply Chain Matters
PCB Design Unrest: Who is going to Fill the Mid-Tier Gap?
224 Gbps and Beyond: The State of High-Speed Electronic 2025-2026 and Beyond
PCBAA Update: Why American PCB Fabrication is Crucial for Engineers and Industry
PCB Design Unrest: How Siemens is Filling the Mid-Tier EDA Gap
Navigating the PCB Mfg. Landscape Heading Into PCB West 2025
Can your Phone Call Space? From 5GTN to 6GNTN and the Digital Twin Revolution
First Principles, SpaceX Lessons, and the Future of PCB Design with AI
Strengthening U.S. Electronics: Supply Chains, Workforce & Innovation with David Schild
Siemens and Microchip Partner to Unleash New Design Workflow
NEW High-Speed Digital Design Masterclass with Eric Bogatin
AI, Power Integrity and, the Future of Engineering
Why Glass Core is the Next Leap in High-Speed Design
Evolved Engineering: Eli Hughes on the New Era of Embedded Development
100th Episode Special: Launching Transmission Lines 101 and a New Masterclass Series with Eric Bogatin
AI Innovation in PCB Design and Manufacturing
Engineering Workflow at the Velocity of Innovation
Tariffs, Turbulence & Tactics: How to Ensure Supply Chain Resilience
High-Speed Interconnects: Copper or Fiber?
Signal Integrity in Practice
From Drone Racing to Disrupting the Military UAV Industry
USA PCB Supply Chain Updates from Capitol Hill
Technological Innovation of Interconnects
AI Design Innovation Trends and IndustryTrajectory in 2025
PDN and Power Integrity Master Class at DesignCon 2025
DesignCon 2025 Preview
AI Hardware Systems: Unprecedented Innovation & Disruption DesignCon 2025
AI-Enabled Data Analytics for Semi and Systems Workflow
Post Election Update: PCB Industry and Supply Chain
The State of the US PCB Industry
Mastering Supply Chain Risk with AI-Driven Data Intelligence
AI and NLP Powered Part Sourcing: Made by EEs for EE’s
The AI Shift: Redefining RF, HSD, and Data Center Design
New AI-Enabled Era of Part Sourcing at Scale
AI-Assisted Schematics: From Thoughts to Circuits in Minutes
Your Ideal AI-Powered Workflow for Hardware Engineers
Accelerating Your Design Cycle with Innovative DfA Practices
Bridging the Gap of HSD and RF PCB Materials
Masterclass LIVE: A Critical Paradigm Shift for Signal Integrity in Practice
2000 Amp Data Centers & AI: The Future of Power & Innovation (Steve Sandler at DesignCon 2024)
Accelerating Your Chip Design IP and Data Management Workflow
Innovation and Trends in ADC Sensor Technology
How to Navigate the Complexities of 3D RF Module Design (SiP)
Is Your Component Data Intelligence Really Intelligent?
Mastering Stability and Reliability of RF/MW Cable Technologies
Chiplets: The Future of Semiconductor Design with Steven Slater
Engineering Salary and Career Insights: How Much Should you be Making?
Effectively designing a Power Delivery System with Expert Lee Ritchey
A Pre-game Coverage of Samtec at DesignCon and The New Era of High-Speed Connectivity
DesignCon 2024: Behind the Scenes Sneak Peek
Expert Memory Design and Implementation
Product Design Process | Navigating the Electronics Engineer’s Journey with Ben Dannan & Heesoo Lee
VNA: Insights into Time & Frequency Domains | Jason Ellison (Rohde & Schwarz)
The Father of IBIS Shares his SI Cheat Sheet
”Chips Don’t Float!” Updates on Strengthening the US PCB Supply Chain
Accurate 3D EM Analysis With a Click of Button | Know How ? Expert - Yuriy Shlepnev (Simberian Inc.)
Circuit Architecture to Schmatic in 60 Seconds
PCB Design for Manufacturing (DFM) & Handoff Mistakes to Avoid | Laura Martin, PCB DfM Expert
Satellites, 5G, Open RAN, PCI6, Chat GPT and Beyond: Samtec’s Expert on High-Speed Tech! - Matt Burns
Ben Dannan: What is enough VDDQ Package PI Analysis for DDR4/5
Signal Integrity | Impedence Modeling | AI in EDA Tools | Expert - Bert Simonowich
EMI and EMC Testing | Simulation | Standards | Expert Insights - Juliano Mologni
EDI CON 2023: Conference Preview
Power Integrity Everywhere: From Space to TikTok
The Signal Integrity Workflow Evolution
Next-Gen Software-Defined PCB Design for Hardware Designers
PCB Industry Visits Capitol Hill and the Impact to Engineers
Understanding and Mitigating Board Level Skew
Onsite Insights IMS 2023: RF Test & Measurement for ”Every Bench”
Onsite Insights IMS 2023: Jim Alexander, Samtec
Onsite Insights IMS 2023: Daren McClearnon, Keysight
Onsite Insights IMS 2023: John Coonrod, Rogers Corporation
Onsite Insights IMS 2023: Laura Martin, Summit Interconnect
Pushing the Limits of High Frequency Interconnect Technology
What to Expect at the International Microwave Symposium (IMS) 2023
How Your PCB Manufacturer Can Drive Your Success
Signal Integrity 101: Fundmentals for Professional Engineers
How to Become a Full-Stack Hardware Engineer
Dr. Alex Lidow: The Mind Behind the Power MOSFET and the rise of eGaN©
Systems Engineering with an Aviators ”Mission” Mindset (Pt 1)
Cracking the EMC Code: Troubleshooting Tips from the Workbench
Hardware and Signal Integrity Efficient Design Flow
Navigating the Pitfalls of RF/MW and mmWave PCB Design, Fab and Assembly
Lee Ritchey & Avishtech Founders on Simulation-Based Design Stack Up
Ben Dannan: The Value of Investing in Your Career at DesignCon
Advancements in Memory, Virtual Simulation, and Enabling Design for Context from Keysight
Boston Dynamics Keynote Inspires with Insight, Passion, and His Robot Dog ”Spot” at DesignCon 2023
How to Pass EMC the First Time, Every Time
Game-Changing Modeling and Simulation for your PCB Stack-Up
Paving the Road to 224G: Preview of Samtec’s Enabling Technologies for DesignCon
VRM Modeling & Simulations for Power Integrity that are Accurate, Simple to do and Blazingly Fast!
DesignCon 2023: A Sneak-Peek of The Super Bowl of High-Speed Electronics
PCBAA: Taking the Fight for a Secure Supply Chain to Washington, DC.
PCB Design Expert Hosts the New PCB Design Podcast
All About Probes and Ensuring Accurate Measurements
Growing RF Interconnect Design Challenges and Solutions