EPISODE · Jun 19, 2026 · 1H 9M
Advanced Packaging, TSMC CoWoS, Intel EMIB
from Semi Doped · host Vikram Sekar and Austin Lyons
New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB.Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS.Three CoWOS flavors: silicon, organic RDL, local bridgesEMIB embeds tiny bridges into the substrate, no interposerEMIB-T and EMIB-M add through-silicon vias and power capacitorsGoogle is booking 3M TPUs on EMIB via MediaTek by 2028Package sizes keep climbing: 5.5x reticle today, 40x aheadThis episode is brought to you by SambaNova. Try SambaNova's fast inference today at the SambaNova Dashboard!Connect with Vik and Austin via a daily free newsletter:https://www.semidoped.comVik's Paid Substack: https://www.viksnewsletter.comAustin's Paid Substack: https://www.chipstrat.comChapters: (0:00) "There Is No Chip Without the Packaging" (0:28) Intro and SpaceX IPO Day (5:15) What We're Covering: CoWOS, EMIB, Google (7:40) Simple Packaging: Wire Bonds to Flip Chip (17:07) What Makes Packaging "Advanced" (33:44) CoWOS: Three Flavors Explained (45:30) EMIB: Intel's Embedded Bridge Approach (52:47) EMIB-T and EMIB-M (57:31) CoWOS vs. EMIB Trade-offs (1:02:18) Google's 3M TPU EMIB Order
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New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB. Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS. Three CoWOS flavors: silicon, organic RDL, local bridgesEMIB embeds tiny bridges into the substrate, no interposerEMIB-T and EMIB-M add through-silicon vias and power capacitorsGoogle is booking 3M TPUs on EMIB via MediaTek by 2028Package sizes keep climbing: 5.5x reticle today, 40x aheadThis episode is br...
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Advanced Packaging, TSMC CoWoS, Intel EMIB
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