EPISODE · Dec 28, 2025 · 18 MIN
🐑ep.151｜面板級封裝、PowerSiP、CPO 三箭齊發先：進封裝營收上看 10 億美元增量!日月光投控(3711)114年Q3法說重點摘要
from Grace懶洋洋 · host Grace懶洋洋
面板級封裝、PowerSiP、CPO 三箭齊發先：進封裝營收上看 10 億美元增量!日月光投控(3711)114年Q3法說重點摘要 🐑本集重點： AI 帶動半導體價值轉型與市場爆發成長,, 以 VIPack 與 FOCoS 異質整合技術突破效能瓶頸,, 佈局三大創新基礎設施：面板級封裝、高效供電 (PowerSiP) 與矽光子 (CPO),,, 2026 營運展望：先進封裝營收顯著成長與測試產能擴充 🐑本節目純屬個人針對公司法說會簡報所作之重點整理筆記，所提之個股資訊僅供參考，不具投資建議，投資人應審慎評估風險，且自負盈虧。 -- Hosting provided by SoundOn
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🐑ep.151｜面板級封裝、PowerSiP、CPO 三箭齊發先：進封裝營收上看 10 億美元增量!日月光投控(3711)114年Q3法說重點摘要
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