EP283. AI ASIC訂單翻轉台灣晶片設計業,世芯、創意和聯發科強勢的背後邏輯? ft. 科技專家吳金榮 episode artwork

EPISODE · May 6, 2026 · 41 MIN

EP283. AI ASIC訂單翻轉台灣晶片設計業,世芯、創意和聯發科強勢的背後邏輯? ft. 科技專家吳金榮

from 數位時代 Business Next · host 數位時代 Business Next

馬斯克的Terafab晶圓廠計畫持續推進,聯手英特爾攏絡三星,同時到台灣來挖人,科技專家吳金榮解讀為對台積電以戰逼和,為接下來上談判桌爭取籌碼。同一時間,台積電北美技術論壇強勢宣告,一路到2029年的1.2奈米製程量產時間表排定,所有客戶和供應商都放心,讓對手繃緊神經。 而跟著AI需求而來的另一大衝擊,是AI客製化晶片持續擴大,亞馬遜、微軟、Google和Meta都來台灣下單委託設計,一波又一波,讓世芯、創意和聯發科這三家公司倍受關注。 AI ASIC的合作邏輯、營運模式和下一步發展,將如何改寫本土晶片設計業的成長空間和國際競爭力? Powered by Firstory Hosting

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EP283. AI ASIC訂單翻轉台灣晶片設計業,世芯、創意和聯發科強勢的背後邏輯? ft. 科技專家吳金榮

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