Warpage in Power Substrates
Got something to say to this podcast? Send a voicemail, and you might hear yourself on the next episode! Episode 167 of the Professor Alex Volinsky podcast. Elastic-plastic FE of active-metal-brazed ceramic substrates: the dangerous stress sits on the ceramic side, where axial residual stress cracks the substrate — elastic-only models mislead. Thickness, size, and clamping pressure are the designer's dials; external pressure cuts both stress and warpage. Based on the paper: Residual Stress and Warpage of AMB Ceramic Substrate Studied by Finite Element Simulations; S.-S. Zhang, H.-S. Yang, K. Gao, L. Yan, X.-L. Pang, A.A. Volinsky; Microelectronics Reliability, 2019, Vol. 98, pp. 49–55. Hosts Elena and Marcus. AI-generated voices.
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