All Episodes
ElectroIQ — 100 episodes
The 12 Days of Cabling
FTTx test trends
Janos Veres PARC
Marc Heyns, fellow at research consortium imec
Dennis Buss, MIT and Texas Instruments
Paul Kirsch, director of front end processes, SEMATECH
Russ Perry, global product manager, Dielectric Deposition Group, Applied Materials
Adam Khan, president, AKHAN Technologies
Hughes Metras, PhD, Leti
Jon Sarno, senior applications engineer, Borrego Solar
Levent Gun, president & CEO, Ampt
May Su, VP, Marketing, Crossing Automation
Rufino Olay, senior marketing solutions manager, Microsemi
Andy London, Global Manager, Photovoltaic Business Unit, Heraeus
Tim Keating, VP of marketing and field operations at Skyline Solar
Ray Burgess, CEO, Solar Power Technologies
Alan King, Canadian Solar
Robert Batten, Azuray Technologies
Peter Brenner, Global Marketing Manager, Photovoltaics, DuPont Microcircuit Materials
Dr. Paul Enquist, CTO, and Daniel Donabedian, president & CEO, Ziptronix
Michael Mills-Price, Control Solutions Manager, Advanced Energy
Simon McElea, president, Invensas
Aki Fujimura, CEO, D2S, and managing company sponsor of the eBeam Initiative
Bill McClean, IC Insights
Amitabh Sabharwal, AMAT
Jim Walker, Gartner
John Trout, DuPont Photovoltaic Fluoromaterials
Jim Cushing, Applied Solar and Andrea Moretto, Applied Materials
Eric Peeters, VP, Dow Corning Solar Business
Casey Miller, director, site solutions, AE Solar Energy
Arlon Martin, VP of marketing, government contracts, and industry relations, Kotura
Joe Cestari, president, Total Facility Solutions
Dwain Aidala, president/COO, sp3 Diamond Technologies
Andy London, global business unit manager at Heraeus
Doug Elder, president & CEO of Boston Semi Equipment (BSE Group) LLC
ATMI's SVP/CTO, Larry Dubois
Jerry Cutini, president & CEO, eIQ Energy; and Oliver Janssen, chief business development officer
Mark Berry, sales director at Metryx
Bettina Weiss, executive director, PV Group, at SEMI
Bob MacKnight, president and CEO of Crossing Automation
Bob Hollands, ASM International (ASMI)
Steve Lerner, CEO of Alchimer
Tony McKie, GM of MEMSSTAR
Markus Wimplinger, EVG
Jonathan Davis, SEMI
Stanley Myers, SEMI
Greg Baker, president & COO of Olympus Integrated Technologies America
Dr. David Lam Multibeam
SPP Process Technology Systems William Johnson
Cymer Nigel Farrar
KLA-Tencor Amir Azordegan
AMEC Ben Lee
TechSearch International Jan Vardaman
EVG Paul Lindner
SEMATECH Sitaram Arkalgud
SEMATECH Dan Armbrust
AMAT targets increasing periphery speed in DRAM with new gate stack system
Applied Materials debuts PVD chambers for DRAM apps at 2Xnm
KLAC gets to root cause of solar yield loss with new product
Undoped, deeply depleted channel rivals FDSOI, FinFETs, says Scott Thompson, SuVolta
How the combinatorial method is evolving, with ATMI
LED markets, 3D standards, and Japan round-up with SEMI
LEDs, EUV and defect detection trends with KLAC
Brewer Science speaks about materials costs vs. system costs in new lithography nodes
Silicon NY: Marcy Nanocenter's goals in the Upstate NY region
Hot papers to see at IITC-MAM
Scaling CdTe PV to HVM: PrimeStar Solar (GE) interview
NIST's work on 3D effects in CdTe/CdS PV devices
28nm: Getting it right at Semico Summit panel
Dean Kamen, 28nm, on tap for the Semico Summit
CNT interconnect: Imec presents research
IBM to present enabling technology for sub-80nm pitch patterning at IITC
Dauskardt Group member to present shear stress data at IITC
DDR2 to DDR3, and 30nm DRAM to bring significant power reduction
Growing molecules for TSV: Alchimer talks electrografting
Improve memory within current semiconductor processes, says Rambus
Henkel research scientist speaks on HB-LED packaging
MonolithIC 3D exec talks gate-last, dropping NuPGA
SEMATECH sees 3D package applications, but warns about manufacturing readiness
Xradia discusses VersaXRM 3D CT X-ray features
Mentor Graphics Poppe on hot lumens and LED testing
Synopsys on stress effects of TSV: no showstoppers
Maryland eyes jobs from renewables projects
Transformer talk with Virginia Transformer Corporation
Grid-tie inverters and turnkey solar products: Schneider Electric interview
Utility-scale solar: Interview with Solar Frontier
Synopsys introduces Proteus LRC for 28nm and below
KLA-Tencor talks 193nm lithography metrology
Aki Fujimura interview: eBeam Initiative update
David Lam on CEBL: A complement to optical lithography
Materials innovation making a difference: Imec's Luc Van den hove
Investor attention shines on solar: Cost/expense with the Mississipi Technology Alliance
Vision and personal mastery: A chat with Terry Brewer, Brewer Science
EUV source technology: Physics talk with Takahisa, Gigaphoton
Kurt Ronse, imec: EUV tool arrives, major source improvement
Toppan Photomasks interview: EUV lithography hurdles, the EUV vs EBDW debate
Nanotech-boosted Li-ion cell capacity: Interview with Zhu, Nanosys
LED manufacturing challenges and market opps: Desroches, ATMI reflects on Strategies in Light
Metal organic precursors for LED manufacturing: Supply and demand talk with Kanjolia, SAFC Hitech
Improving LED efficiency: Discussion with Uhrmann, EV Group